Click on the webinar titles below to download a PDF of the presentations, which (in most cases) include a link to the recorded webinar.

Advanced Packaging Series

(All of the following presentations are for INEMI members only and require log-in, unless otherwise noted.)

Evolution of Power Packaging: Assembly and Thermal Interface Materials, Andy Mackie, PhD (Indium Corporation), March 28, 2023       Presentation          Recording 
Material Trends in Fan-out WLP and PLP, Tanja Braun (Fraunhofer IZM), May 16, 2023
A View on State-of-the-Art Lithography for Advanced Packaging, Jorge P. Fernandez, Ph.D. (Applied Materials), June 20, 2023

Challenges and Solutions for AI Servers with Substrate Sizes Greater than 100x100mm, Dr. Dyi Chung Hu (SiPlus Co.), July 19, 2023

Toward the Physical Reliability of 3D-Integrated Systems, Yaw Obeng, National Institute of Standards and Technology (NIST), September 26, 2023 (presentation is available to the public)
Photonics Systems for High Performance, Dr. Tolga Tekin (Fraunhofer IZM), October 31, 2023  
LSI/PKG/PCB Co-Design to Support 3D-IC/Chiplet Design, Kazunari Koga (Zuken Inc.), November 28, 2023 

Counterfeit Components Series

Series Overview
 
Counterfeit Components #1: Size and Breadth of Counterfeit Risks (October 19, 2023)
Counterfeit Risk Runs Throughout the End-to-End Supply Chain, Ben German (Intel)
Size and Breadth of the Problem, Michelle Lam (IBM)
Onshoring Advanced Packaging and the Impact on Counterfeiting, Charles Woychik (SkyWater Technology)

Counterfeit Components #2: Counterfeit Management and Best Practices (November 7, 2023)
Counterfeit Avoidance and Detection: An Overview of SAE Standards, Michael Azarian, PhD (CALCE, University of Maryland)
Counterfeit Reporting Trends 2022, Richard Smith (ERAI)
Counterfeit Materials vs. Sustainable Business Models, Michael Ford (Aegis Software)
 
Counterfeit Components #3: Emerging Trends in Counterfeit Detection and Mitigation (December 7, 2023)    
Understanding Counterfeit Electronics Detection and Mitigation, Navid Asadi (University of Florida)
INEMI Roadmap: Data for Material Handling and Conversion, Francis Mullany, PhD (INEMI)  
Results of INEMI survey regarding industry experiences with counterfeit components and strategies used to mitigate risk, Paul Hale (NIST), Ben German (Intel Corporation) and Mark Schaffer, moderator (INEMI)

Low-Temperature Solder Series

Electromigration in Tin-Bismuth Planar Solder Joints, Prabjit Singh, PhD (IBM), October 17/18, 2023    

Smart Manufacturing Series

Discover the Evolving A.I. Powered Solution towards Smart Manufacturing, Piet Gek Tan (Vitrox), February 15/16, 2023  

Transforming Electronics Manufacturing Inspection with Vision AI, Arif Virani and Bart Piwowar (DarwinAI), May 16, 2023

Supercharge the Industrial Workforce with Domain Knowledge and Generative AI, Dr. Roshan Nanu (Aitomatic), July 12 & 13, 2023

Sustainable Electronics Technology Integration Group (TIG) Series

Autonomous Industrial Monitoring — Vertical Farming and Beyond, Tom Okrasinski (Nokia Bell Labs), January 11, 2023

Standards for a Circular Economy and Product Design, KC Norris and Vincenzo Ferrero (NIST), April 5, 2023 (recording, but no presentation available; INEMI members only)

PFAS Overview, Suhani Chitalia and Kelly Scanlon (IPC Global Government Relations), May 3, 2023 (members only; requires log-in) 

Why Now for LCAs in Electronics, Philip Smoller and Vagais Hussai (Makersite), June 7, 2023